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广州市百庄新材料有限公司
广州市百舜合成材料有限公司
BZ-3900(BK)

BZ-3900(BK)

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Product Introduction:



BZ-3900A/B is widely used in the potting of LED power supplies, high-power electronic components, electronic and electrical modules and circuit boards that require high heat dissipation and temperature resistance.

The product meets the environmental protection requirements of RoHS/Reach and meets the flame retardant requirements of UL-V0 level.
✱  
It's addition-curable silicone, can be cured at room temper ature or cured by heating, with good fluidity.

✱  The cured colloid has excellent weather resistance and corrosion resistance, which can ensure the normal use of the lighting in a wide temperature range (-60 ~ 200 ).


Basic parameters of the product (non-absolute value, for reference only):


IndicatorsCuring agent 3900 AResin agent 3900 B
AppearanceBlackBeige
Viscosity  (CPS)2000±5002000±500
Mixed viscosity  (CPS)2000±300
Density (g/cm³ .25℃)1.56±0.051.56±0.05
Usage ratio  (weight ratio)A:B=1:1
Pot life  100g (min. 25 ℃)30±10
Curing conditionsRoom temperature curing or heating curing
Gel time (min.25 ℃)65-85
Color (after curing)Black
Hardness (ShoreA/D)50±8A
Curing time(23~25℃)3-6H
Curing time (Heating)80 ℃ for 20 minutes
Temperature resistance  (℃)-60℃~200℃
Water absorption (24H)≤0.5%
Anti-UV Grade(GB/T14522-2008)/
Thermal conductivity (W/m.k)0.6 
Dielectric Strength (kV/mm)≥18
Surface Resistivity (Ω/sp)≥1.0×1012
Volume resistivity (Ω.cm)≥1.0×1012
Flame retardant  (UL94)V0
Dielectric constant (1K Hz)4
Tensile strength (MPa)/
Ultimate elongation  (%)/
Average coefficient of linear expansion195×10-6K-1
Electrification index (CTI)/


The online data is for reference only, please contact us to get the latest version, and the official TDS data shall prevail.